ASUS TUF Gaming B550-Plus Wi-Fi Motherboard in Bangladesh
Get the property you crave and also the performance you wish with the TUF Gaming B550-Plus Wi-Fi AM4 ATX Motherboard from ASUS. that includes the AMD B550 chipset, Asus TUF GAMING B550-PLUS WI-FI ATX motherboard is compatible with CPUs conformist to the AM4 socket. Four RAM slots support up to 128GB of dual-channel memory and speed up the 4800 rates once overclocking. Asus TUF GAMING B550-PLUS WI-FI Connect storage drives victimization six SATA III interfaces or two M.2 slots. Up to 2 graphics cards will be put in using PCIe 4.0 x16 and PCIe 3.0 x16 slots that support 2-way AMD CrossFireX. alternative adapter cards can be installed in 3 PCIe 3.0 x1 slots. A rear I/O panel sports a USB 3.2 information pair of Type-A and Type-C ports, additionally as four USB 3.2 information one and two USB 2.0 Type-A ports. Connect displays victimization the DisplayPort or HDMI outputs, or connect the audio employing a S/PDIF port or 5 3.5mm jacks. the Asus TUF GAMING B550-PLUS WI-FI associate RJ45 port supports 2.5 Gigabit Ethernet, and two Wi-Fi connectors alter Wi-Fi half 6 connectivity. A BIOS flashback button is additionally present. The ASUS TUF play B550-Plus Wi-Fi AM4 ATX Motherboard supports 7.1-channel surround sound via the Realtek ALC S1200A audio codec and supports Windows ten 64-bit operational systems.
Intel Wi-Fi 6 AX200
The Asus TUF GAMING B550-PLUS WI-FI 6 AX200 module is compatible with the 802.11ax commonplace and is optimized for additional economical operation on thronged networks with competitors’ traffic. try Asus TUF GAMING B550-PLUS WI-FI motherboard with Wi-Fi 6 routers to completely expertise the networking potential of Wi-Fi 6.
The Asus TUF GAMING B550-PLUS WI-FI Motherboard aboard VRM of TUF play B550-Plus Wi-Fi utilizes 8+2 DrMOS power stages that mix high- and low-side MOSFETs and also the driver into one package, delivering optimum power and potency for third information AMD Ryzen Processors. Asus TUF GAMING B550-PLUS WI-FI Two-ounce copper layers draw heat far from vital elements to stay them at their best operational temperatures and provide additional headroom to push CPUs on the far side stock speeds.